Welcome to the official website of the 2019 The 4th International Conference on Materials Technology and Applications (ICMTA2019). The conference will be held from October 11 to 14, 2019 in Kyoto, Japan. The conference will be held in conjunction with ICNNN 2019 as the workshop,  providing great opportunity for ICMTA participants to meet researchers in other related fields as well.

Important Conference Deadlines

Paper Final Submission Deadline: June 30, 2019
Notification of Paper Acceptance: July 15, 2019
Registration Deadline: July 30, 2019

About the Conference

ICMTA2019 would be an excellent international conference for sharing knowledge and results in Materials Technology and Applications. Its aim to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cutting-edge development in the field.

The primary goal of the conference is to exchange, share and distribute the latest research and theories from our international community. The conference will be held every year to make it an ideal platform for people to share views and experiences in Materials Technology and Applications related fields.


Prospective authors are invited to submit original research papers which have not been submitted or published by other conferences or journals. Submitted papers will be peer-reviewed and the accepted papers and posters will be published into the conference proceedings and submit for indexing.

ICMTA 2018 papers have been uploaded in TTP-MSF digital base after the conference. The latest information will be mailed ASAP.
ICMTA 2017: MSF-Materials Science Forum
ISBN:978-3-0357-1201-8). (Online) (EI, SCOPUS INDEX)
ICMTA 2016: MSF-Materials Science Forum  (ISBN:978-3-0357-1104-2). (Online) (EI, SCOPUS INDEX)

ICMTA 2019 conference proceedings will be published, included as one volume of Materials Science Forum as well, "Materials Science Forum" is one of the largest periodicals in its field.

For online and index information: http://www.ttp.net/0255-5476.html
Materials Science Forum | ISSN: 1662-9752


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